BGA Rework Station

1.Embedded Windows system, 2.7 inch touch screen control 3.support U disk and mouse 4.Top heater use hot 5.Touch screen

Features:1. Embedded Windows system, 7 inch touch screen control, support U disk and mouse.                 2. Six-axis PLC and 8 temperature control system to control heating process accurately.                                3. Side camera to monitor melting process of solder ball.4. Top heater use hot air, bottom heater use hot air and IR to preheat the whole PCB board.5. This machine pick, place, remove, reflow and recycle component auto. Optical alignment system can move in X and Y axis to enlarge observation range during alignment.6. Welding, reflow and auto process all can set independent, suitable for different rework technology and different operator.               7. Top heater height can be adjust after auto process, user-friendly                                                                                                    8. Placement height and heating height of top heater can be set or detect auto.9. It can display 10 temperature profiles at the same time or select to display. 2 set temperature profile, 3 actual temperature profile and 5 external test temperature profile. Temperature profile can download and save.    10. Analysis slop, temperature and time difference auto. It can set liquid line to observe temperature profile.11.Three independent heater all can set 9 segments heating, cooling and constant temperature, saved temperature profile is unlimited. Parameter can add description, such as PCB model, nozzle model, lead or lead-free.12. IR preheat area can choose according to PCB size.13.Built-in vacuum pump, no need gas source. Reserved Nitrogen interface

Configuration:

1. Top heater use hot air to heat the top side of BGA, heating tube is made in Germany.

2. Bottom heater

3. IR heater, used to preheat the whole PCB board to avoid deformation caused by temperature difference.

4. Touch screen, 7inches

5. Monitor

6 Side camera to observe melting process of solder ball.

7.X, Y axis fine-tuning

8 Optical Alignment

SPECIFICATION

PCB Size	≤L760×W760mm
PCB Thickness	0.1~5mm
Fine-tuning accuracy	0.01mm
Angle fine-tuning	360°
Temperature Control	K thermocouple Closed loop
PCB Positioning mode	Outer
Bottom preheat	Infrared 4200W
Main (upper+bottom) heater	Hot air  800W+800W
Power used	Single phase 220V,50/60Hz,6.3KVA
Dimension	L1410×W760×H1530mm
Weight	Approx. 250kgs

BGA Rework Station