BGA Rework Station

1.Embedded Windows system, 2.7 inch touch screen control 3.support U disk and mouse 4.PCB size Max L640xW500 5.thick 0.1-5mm

GP-1000C BGA Rework Station

1.Embedded Windows system,2.7 inch touch screen control3.support U disk and mouse4.PCB size Max L640xW5005.thick 0.1-5mm

Features:

1. Embedded Windows system, touch screen control. It can display 3 actual temperature profile and 5 external test temperature profile.2.HD color optical alignment system, optical zoom up to 22 times.3. Optical alignment system can move right and left, front and back, enlarge observation range;4. Top heater and pickup tube 2 in 1 design, alignment, placement, reflow and remove component auto.5. Top heater use hot air, bottom heater use hot air and IR to preheat the whole PCB board6. Three independent heater all can set 9 segments heating, cooling and constant temperature,7. Bottom heater equipped with support, it can adjust up and down to support bottom side of PCB board to prevent deformation8. Cross-flow fan to cool PCB board after remove and reflow to ensure welding effect 9. Nozzle of top and bottom heater can be 360 degree rotary, easy to change. There is different size of nozzle or can be customized.10.Build-in vacuum pump, no need gas source

Configuration:

1. Top heater use hot air to heat the top side of BGA, heating tube is made in Germany.

2. Bottom heater

3. IR heater, used to preheat the whole PCB board to avoid deformation caused by temperature difference.

4. Touch screen, 7inches

5. Monitor

6 Side camera to observe melting process of solder ball.

7.X, Y axis fine-tuning

8 Optical Alignment

Specification

PCB Size	≤L640×W500mm
PCB Thickness	0.1~5mm
Angle fine-tuning	45°
Temperature Control	K Sensor   Closed loop
Fine-tuning accuracy	0.01mm
PCB Positioning	Outer
Sub (Bottom) heater	Infrared   2400W
Main (Top) heater	Hot air   800W+800W
Power Supply	Single phase  220V,50/60Hz,4.5KVA
Machine dimension	L820×W870×H880mm
Weight of machine	Approx. 98kgs

BGA Rework Station